GENEVA, Sept. 18 -- SINFONIA TECHNOLOGY CO., LTD. filed a patent application (JP2026/006811) for “DISPENSING DEVICE”. With publication no. WO/2026/186547, here are the other details related to the pat... Read More
GENEVA, Sept. 18 -- FURUKAWA FITEL OPTICAL COMPONENTS CO., LTD. filed a patent application (JP2026/006816) for “MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MODULATOR”. With publication no. WO/20... Read More
GENEVA, Sept. 18 -- FURUKAWA FITEL OPTICAL COMPONENTS CO., LTD. filed a patent application (JP2026/006816) for “MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MODULATOR”. With publication no. WO/20... Read More
GENEVA, Sept. 18 -- NTN CORPORATION filed a patent application (JP2026/006833) for “RESIN MOLDED INSULATED BEARING”. With publication no. WO/2026/186550, here are the other details related to the pate... Read More
GENEVA, Sept. 18 -- NATIONAL UNIVERSITY CORPORATION YAMAGATA UNIVERSITY filed a patent application (JP2026/006770) for “COOLING DEVICE AND COOLING UNIT UTILIZING LATENT HEAT OF EVAPORATION”. With publ... Read More
GENEVA, Sept. 18 -- DEVICE LAB INC. filed a patent application (JP2026/006773) for “ELECTRONIC DEVICE TEMPERATURE MEASUREMENT METHOD”. With publication no. WO/2026/186544, here are the other details r... Read More
GENEVA, Sept. 18 -- DEVICE LAB INC. filed a patent application (JP2026/006773) for “ELECTRONIC DEVICE TEMPERATURE MEASUREMENT METHOD”. With publication no. WO/2026/186544, here are the other details r... Read More
GENEVA, Sept. 18 -- TOKYO ELECTRON LIMITED filed a patent application (JP2026/006799) for “SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE, AND STORAGE MEDIUM”. With publication no. WO/2026/1... Read More
GENEVA, Sept. 18 -- TOKYO ELECTRON LIMITED filed a patent application (JP2026/006799) for “SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE, AND STORAGE MEDIUM”. With publication no. WO/2026/1... Read More
GENEVA, Sept. 18 -- FUJIFILM CORPORATION filed a patent application (JP2026/006807) for “IMPRINT UNDERLAYER PRECURSOR, COMPOSITION FOR FORMING IMPRINT UNDERLAYER, UNDERLAYER, PATTERN FORMATION METHOD,... Read More